Home > Thermal Conductive Pad >

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

Product Categories

Phase Changing Materials [40]
Thermal Conductive Pad [164]
Thermal Gap Filler [196]
Thermal Conductive Grease [27]
Thermal Insulation Materials [48]
Thermal Graphite Sheet [56]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

Name: High Performance 20mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory
Brand: ZIITEK
Price: 1 USD

Quality High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory for sale

Brand Name : ZIITEK

Model Number : TIF780RUS Series

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Products name : High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

Thermal conductivity& Compostion : 8.5W/m-K

Construction : Ceramic filled silicone elastomer

Keywords : Computer Cooling Thermal Pad

Specific Gravity : 3.2g/cc

Color : Gray

Continuos Use Temp : -45℃ to 200℃

Hardness : 20 Shore 00

Thickness : 2.0mmT

Application : CPU,Display card,Mainboard/mother board

Contact Now

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

The TIF780RUS thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features:
> Good thermal conductive:8.5W/MK
> Soft and compressible for low stress applications
> Available in varies thicknesses
> RoHS compliant
> UL recognized
> Easy release construction
> Electrically isolating
> High durability

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Heat pipe thermal solutions
> Set top boxes
> Audio and video components
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power

Typical Properties of TIF780RUS Series
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Specific Gravity	3.2g/cc	ASTM D297
thickness	2.0mmT	ASTM D374
Hardness (thickness＜1.0mm)	20 (Shore 00)	ASTM 2240
Continuos Use Temp	-45 to 200℃	******
Dielectric Breakdown Voltage	>3500 VAC	ASTM D149
Dielectric Constant	5.1~6.1MHz	ASTM D150
Volume Resistivity	1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	8.5W/m-K	ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Product Tags:

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory

2.0mm Thermal Conductivity Pad

Laptop Silicone Thermal Conductivity Pad

High Performance Thermal Conductivity Pad

High Performance 2.0mm CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory Images